- Welcome To EMIE 2025 -
2025 5th International Conference on Electronic Materials and Information Engineering (EMIE 2025) will be held in Harbin, China from September 12 to 14, 2025. It is a leading conference for all researchers from different countries and territories to present their research results about Electronic Materials and Information Engineering.
The organizing committee invited a few accomplished experts in related research areas to give keynote speeches at the conference. All participants have a chance to discuss with the experts face to face, which will be definitely helpful for the participants to improve their study and research in the future. We warmly welcome prospective authors who are interested in the fields to submit their up-to-date and original research papers to the EMIE 2025 Organizing Committee to share their valuable experience with the leading researchers, scholars as well as experts of the fields around the world.
Full Paper Submission Date September 5, 2025 | Registration Deadline September 7, 2025 | Final Paper Submission Date September 10, 2025 | Conference Dates September 12-14, 2025 |
- Call For Papers -
Topics of interest include but are not limited to
Physical chemistry
Semiconductor material
Conductive metals and their alloys
Electromagnetic shielding material
Dielectric material
Piezoelectric and ferroelectric materials
Magnetic material
Optoelectronic material
Integrated circuit
Electronic science and technology
Information and communication Engineering
Optoelectronic information science and technology
Engineering optics
Information optics
Electronic technology
Photoelectric technology
Communication technology
Measurement and control technology
Computer application technology
- Submission -
Submission System (For Authors From China) Submission System (For Author From Other Countries)
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- Publication -
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers will be submitted to IEEE (ISBN: 979-8-3315-5771-3) for publication, and it will be submitted to IEEE Xplore, EI Compendex and Scopus for indexing.
- Sponsored By -
Please send the full paper(word+pdf) to Submission System :